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Recommend for Intel® Sapphire Rapids Processor, Socket FCLGA 4677, Aluminum Fin Stack, 5 Heatpipes with Vapor Chamber Base, Passive Cooler for 2U Server and up, Support 350W CPU powered heat dissipation.
Note:
Dynatron S2, S3, S4, S5, S6, and S7 each comes with E1B Package Carrier.
E1A and E1C Package Carriers are not included but they are available upon request.
CPU Support |
Intel® Sapphire Rapids Processor |
CPU Socket |
Socket FCLGA 4677 |
Solution |
2U Server and up |
Dimensions |
118 x 78 x 64 mm |
Weight |
526.60 g |
Material |
Copper Vapor Chamber and heat pipe, Aluminum Fin Stack |
Thermal Grease |
Pre-Printed with SHIN-ETSU 7762 |
*All product specifications and product images are subject to change without notice.
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Our pricing is always guided by the principles of a fair price. We do not artificially move prices or brag about inflated percentages. You can always find price history for each product.
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